Integrated Optics for telecommunication and sensing applications

Abstract:

The ever-growing need for high-rate communications with ever denser nodes and smaller form factor is bringing communication requirements at the chip level towards what was once datacom and telecom specifications. Communication on a single silicon chip is pushing technological progress to the limit. On-chip optical communication can overcome the limits of electronics (e.g., electromagnetic interference, power consumption) that hinder the scaling to higher rates and longer propagation distances. Moreover, optics offer inherent mechanisms for multiplexing multiple transmissions, enabling higher capacity through parallelization. 
In this seminar some examples of components, and integrated sub-system will be presented demonstrating the potential of integrated silicon photonics for telecommunication and other fields of applications like sensing applications.